|
YSi-X |
Applicable PCB |
Size |
L100 × W50 to L560 × W460mm |
Mounted components |
Upper limit 40mm, lower limit 80mm (40mm during inline) |
Warpage |
2.0mm or less |
Weight |
2.0kg or less |
X-ray inspection |
TypeD |
TypeB |
X-ray detector |
FOS flat panel system High speed type |
Direct conversion panel method Long service life type |
Resolution |
7 to 54μm |
18 to 54μm |
Maximum field of view |
62 × 78mm |
52 × 45mm |
Inspection speed 2D-X |
93.7 ㎠ / sec |
24.0 ㎠ / sec |
Inspection speed 3D-X |
15.5 ㎠ / sec |
4.0 ㎠ / sec |
Method |
3D sliced images through digital laminography (planar CT) |
X-ray source |
Microfocus closed tube |
Tube voltage |
Max. 130KV |
Inspection region (PCB center section) |
3D : L510 × W460 mm, 2D : L560 × W460 mm |
Visible inspection |
Inspection speed |
0.4 sec. / field of view |
Resolution |
10μm / 19μm |
Lighting |
3-layer dome lighting, upper White(R/G/B) & infrared, mid-White(R/G/B), lower White(R/G/B) |
Image capture system |
5 megapixels digital color camera, telecentric lens |
Inspection region |
L560 × W460 mm |
Laser inspection |
Resolution / Method |
5µm (height direction) / Triangulation distance measurement by laser spot light |
Inspection region (PCB center section) |
L510 × W360 mm |
X-ray leakage quantity |
Less than 0.2µSv/h |
Power supply / Air supply source |
3-phase AC 200/208/220/240/380/400/416V ±10% 50/60 Hz / 0.45MPa or more |
External dimensions / Weight |
L1,710 × D1,883 × H1,705mm (excluding protrusions) / Approx. 2,900kg |